Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854872 | Semiconductor device structure with interconnect structure and method for forming the same | Chun-Hao Kung, Kao-Feng Liao, Hui-Chi Huang, Kei-Wei Chen | 2023-12-26 |
| 11850704 | Methods to clean chemical mechanical polishing systems | Yen-Ting Chen, Hui-Chi Huang, Kei-Wei Chen | 2023-12-26 |
| 11841541 | Package assembly and manufacturing method thereof | Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang | 2023-12-12 |
| 11833589 | Hinge bracket of an information handling system formed by metal injection molding | Wei Li, Chun He | 2023-12-05 |
| 11830864 | Photonic semiconductor device and method | Chung-Hao Tsai, Chuei-Tang Wang, Hsing-Kuo Hsia, Chen-Hua Yu | 2023-11-28 |
| 11830841 | Semiconductor package and method for manufacturing the same | Chuei-Tang Wang, Yu-Kuang Liao, Hsing-Kuo Hsia, Chih-Yuan Chang, Jeng-Shien Hsieh +1 more | 2023-11-28 |
| 11605622 | Photonic semiconductor device and method | Chung-Hao Tsai, Chuei-Tang Wang, Hsing-Kuo Hsia, Chen-Hua Yu | 2023-03-14 |