Issued Patents 2023
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854901 | Semiconductor method and device | Cheng-Hsiung Yen, Ta-Chun Ma, Chien-Chang Su, Jung-Jen Chen, Pei-Ren Jeng +1 more | 2023-12-26 |
| 11854872 | Semiconductor device structure with interconnect structure and method for forming the same | Chun-Hao Kung, Chih-Chieh Chang, Kao-Feng Liao, Hui-Chi Huang | 2023-12-26 |
| 11854827 | Magnetic slurry for highly efficiency CMP | Yen-Ting Chen, Chun-Hao Kung, Tung-Kai Chen, Hui-Chi Huang | 2023-12-26 |
| 11850704 | Methods to clean chemical mechanical polishing systems | Chih-Chieh Chang, Yen-Ting Chen, Hui-Chi Huang | 2023-12-26 |
| 11772228 | Chemical mechanical polishing apparatus including a multi-zone platen | Ting-Hsun Chang, Hung Yen, Chi-Hsiang Shen, Fu-Ming Huang, Chun-Chieh Lin +4 more | 2023-10-03 |
| 11761751 | Thin film metrology | Chih-Hung Chen, Te-Ming Kung | 2023-09-19 |
| 11728215 | Fin Field-Effect Transistor device and method of forming the same | Shich-Chang Suen, Liang-Guang Chen | 2023-08-15 |
| 11728172 | Wafer thinning apparatus having feedback control | Yuan-Hsuan Chen, Ying-Lang Wang, Kuo-Hsiu Wei | 2023-08-15 |
| 11718812 | Post-CMP cleaning composition for germanium-containing substrate | Ji Cui, William Weilun Hong, Gin-Chen Huang, Shich-Chang Suen | 2023-08-08 |
| 11712778 | Chemical mechanical planarization tool | Tung-Kai Chen, Shang-Yu Wang, Wan-Chun Pan, Zink Wei, Hui-Chi Huang | 2023-08-01 |
| 11710659 | Metal loss prevention using implantation | Li-Chieh Wu, Tang-Kuei Chang, Kuo-Hsiu Wei, Ying-Lang Wang, Su-Hao Liu +5 more | 2023-07-25 |
| 11694889 | Chemical mechanical polishing cleaning system with temperature control for defect reduction | Ssutzu Chen, Gin-Chen Huang, Ya-Ting Tsai, Ying-Tsung Chen | 2023-07-04 |
| 11685013 | Polishing pad for chemical mechanical planarization | Chih-Hung Chen, Ying-Lang Wang | 2023-06-27 |
| 11679469 | Chemical mechanical planarization tool | Michael Yen, Kao-Feng Liao, Hsin-Ying Ho, Chun-Wen Hsiao, Sheng-Chao Chuang +7 more | 2023-06-20 |
| 11675953 | Hotspot avoidance method of manufacturing integrated circuits | I-Shuo Liu, Chih-Chun Hsia, Hsin-Ting Chou, Kuanhua Su, William Weilun Hong +1 more | 2023-06-13 |
| 11670690 | Semiconductor device with dielectric spacer liner on source/drain contact | Chi-Cheng Hung, Yu-Sheng Wang, Ming-Ching CHUNG, Chia-Yang Wu | 2023-06-06 |
| 11664213 | Bevel edge removal methods, tools, and systems | Hui-Chi Huang, Jeng-Chi Lin, Pin-Chuan Su, Chien-Ming Wang | 2023-05-30 |
| 11658065 | Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin +7 more | 2023-05-23 |
| 11633829 | External heating system for use in chemical mechanical polishing system | Yi-Sheng Lin, Chi-Hsiang Shen, Chi-Jen Liu, Chun-Wei Hsu, Yang-Chun Cheng | 2023-04-25 |
| 11637021 | Metal heterojunction structure with capping metal layer | Yi-Sheng Lin, Chi-Jen Liu, Chi-Hsiang Shen, Te-Ming Kung, Chun-Wei Hsu +4 more | 2023-04-25 |
| 11631618 | Thickness sensor for conductive features | Chih-Hung Chen, Ying-Lang Wang | 2023-04-18 |
| 11621342 | Semiconductor device, method, and tool of manufacture | Chih-Hung Chen, Ying-Lang Wang | 2023-04-04 |
| 11594680 | Method of forming a FinFET device | Chang-Miao Liu, Bwo-Ning Chen | 2023-02-28 |
| 11590627 | Mega-sonic vibration assisted chemical mechanical planarization | Chun-Hao Kung, Shang-Yu Wang, Ching-Hsiang Tsai, Hui-Chi Huang | 2023-02-28 |
| 11569387 | Semiconductor device including fin structures and manufacturing method thereof | Chun Hsiung Tsai | 2023-01-31 |