Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810857 | Via for semiconductor device and method | Chia-Pang Kuo, Chih-Yi Chang, Ming-Hsiao Hsieh, Wei Hsiang Chan, Ya-Lien Lee +2 more | 2023-11-07 |
| 11772228 | Chemical mechanical polishing apparatus including a multi-zone platen | Ting-Hsun Chang, Hung Yen, Chi-Hsiang Shen, Fu-Ming Huang, Tsung-Hsien Chang +4 more | 2023-10-03 |
| 11728157 | Post-CMP cleaning and apparatus | Fu-Ming Huang, Liang-Guang Chen, Ting-Kui Chang | 2023-08-15 |
| 11679469 | Chemical mechanical planarization tool | Michael Yen, Kao-Feng Liao, Hsin-Ying Ho, Chun-Wen Hsiao, Sheng-Chao Chuang +7 more | 2023-06-20 |
| 11676898 | Diffusion barrier for semiconductor device and method | Chia-Pang Kuo, Huan-Yu Shih, Wen-Hsuan Chen, Cheng-Lun Tsai, Ya-Lien Lee +3 more | 2023-06-13 |
| 11660345 | Method and composition for enhancing the delivery of anti-platelet drugs for the treatment of acute stroke | Jen C. Lin, Hsu-Tung Lee, Yu-Ming Fan, Jui-Chi Tsai | 2023-05-30 |
| 11658065 | Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Wei-Wei Liang +7 more | 2023-05-23 |