Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854878 | Bi-layer alloy liner for interconnect metallization and methods of forming the same | Huei-Wen Hsieh, Kai-Shiang Kuo, Cheng-Hui Weng, Chun-Sheng Chen | 2023-12-26 |
| 11676898 | Diffusion barrier for semiconductor device and method | Chia-Pang Kuo, Huan-Yu Shih, Cheng-Lun Tsai, Ya-Lien Lee, Cheng-Hui Weng +3 more | 2023-06-13 |