Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854878 | Bi-layer alloy liner for interconnect metallization and methods of forming the same | Kai-Shiang Kuo, Cheng-Hui Weng, Chun-Sheng Chen, Wen-Hsuan Chen | 2023-12-26 |
| 11694899 | Interconnect structures and methods and apparatuses for forming the same | Chun-Hsu Yang, Chun-Sheng Chen, Nai-Hao Yang, Kuan-Chia Chen, Yu-Cheng Hsiao +1 more | 2023-07-04 |