Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854878 | Bi-layer alloy liner for interconnect metallization and methods of forming the same | Huei-Wen Hsieh, Kai-Shiang Kuo, Cheng-Hui Weng, Wen-Hsuan Chen | 2023-12-26 |
| 11715765 | Method of manufacturing channel all-around semiconductor device | — | 2023-08-01 |
| 11694899 | Interconnect structures and methods and apparatuses for forming the same | Chun-Hsu Yang, Nai-Hao Yang, Kuan-Chia Chen, Huei-Wen Hsieh, Yu-Cheng Hsiao +1 more | 2023-07-04 |
| 11688761 | Multilayer capacitive element having aspect ratio modulation structure and design method of the same | — | 2023-06-27 |