Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854878 | Bi-layer alloy liner for interconnect metallization and methods of forming the same | Huei-Wen Hsieh, Cheng-Hui Weng, Chun-Sheng Chen, Wen-Hsuan Chen | 2023-12-26 |
| 11777035 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Po-Cheng Shih +1 more | 2023-10-03 |