Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855154 | Vertical interconnect features and methods of forming | Po-Yu Huang, Shih-Che Lin, Chao-Hsun Wang, Kuo-Yi Chao, Mei-Yun Wang +2 more | 2023-12-26 |
| 11777035 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih +1 more | 2023-10-03 |
| 11652149 | Common rail contact | Cheng-Wei Chang, Hong-Ming Wu, Li-Hsiang Chao, Yi-Ying Liu | 2023-05-16 |
| 11630479 | Apparatus for adjusting skew of circuit signal and adjusting method thereof | Tse-Wei Wu, Min-Hsiu Tsai | 2023-04-18 |
| 11552018 | Chemical direct pattern plating method | Wen-Jiun Liu, Hung-Wen Su, Ming-Hsing Tsai, Syun-Ming Jang | 2023-01-10 |