Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11856745 | Compact electrical connection that can be used to form an SRAM cell and method of making the same | Yu-Kuan Lin, Chang-Ta Yang, Ping-Wei Wang, Mei-Yun Wang | 2023-12-26 |
| 11855154 | Vertical interconnect features and methods of forming | Po-Yu Huang, Shih-Che Lin, Chao-Hsun Wang, Mei-Yun Wang, Feng-Yu Chang +2 more | 2023-12-26 |
| 11735665 | Dielectric fin structure | Yu-Shan Lu, Chung-I Yang, Wen-Hsing Hsieh, Jiun-Ming Kuo, Chih-Ching Wang +1 more | 2023-08-22 |
| 11721590 | Semiconductor device and method | Shih-Chieh Wu, Pang-Chi Wu, Mei-Yun Wang, Hsien-Huang Liao, Tung-Heng Hsieh +1 more | 2023-08-08 |
| 11682729 | Methods of forming air spacers in semiconductor devices | Chao-Hsun Wang, Chen-Ming Lee, Mei-Yun Wang, Pei-Yu Chou, Kuo-Ju Chen | 2023-06-20 |
| 11670544 | Via-first process for connecting a contact and a gate electrode | Chao-Hsun Wang, Mei-Yun Wang, Wang-Jung Hsueh | 2023-06-06 |
| 11621267 | Compact electrical connection that can be used to form an SRAM cell and method of making the same | Yu-Kuan Lin, Chang-Ta Yang, Ping-Wei Wang, Mei-Yun Wang | 2023-04-04 |