Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670544 | Via-first process for connecting a contact and a gate electrode | Chao-Hsun Wang, Mei-Yun Wang, Kuo-Yi Chao | 2023-06-06 |
| 11640936 | Interconnect structures and methods of fabrication thereof | Chao-Hsun Wang, Fu-Kai Yang, Mei-Yun Wang, Sheng-Hsiung Wang, Shih-Hsien Huang | 2023-05-02 |