Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855154 | Vertical interconnect features and methods of forming | Po-Yu Huang, Shih-Che Lin, Kuo-Yi Chao, Mei-Yun Wang, Feng-Yu Chang +2 more | 2023-12-26 |
| 11682579 | Method of forming trenches with different depths | Hsien-Cheng Wang, Mei-Yun Wang | 2023-06-20 |
| 11682729 | Methods of forming air spacers in semiconductor devices | Chen-Ming Lee, Kuo-Yi Chao, Mei-Yun Wang, Pei-Yu Chou, Kuo-Ju Chen | 2023-06-20 |
| 11670544 | Via-first process for connecting a contact and a gate electrode | Mei-Yun Wang, Kuo-Yi Chao, Wang-Jung Hsueh | 2023-06-06 |
| 11640936 | Interconnect structures and methods of fabrication thereof | Wang-Jung Hsueh, Fu-Kai Yang, Mei-Yun Wang, Sheng-Hsiung Wang, Shih-Hsien Huang | 2023-05-02 |