Issued Patents 2023
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855169 | Silicide structures in transistors and methods of forming | Kai-Di Tzeng, Chen-Ming Lee, Mei-Yun Wang | 2023-12-26 |
| 11855161 | Semiconductor device contact structures and methods of fabricating thereof | I-Wen Wu, Chen-Ming Lee, Mei-Yun Wang | 2023-12-26 |
| 11843028 | Isolation features and methods of fabricating the same | I-Wen Wu, Chen-Ming Lee, Mei-Yun Wang, Jr-Hung Li, Bo-Cyuan Lu | 2023-12-12 |
| 11791387 | Semiconductor devices with backside via and methods thereof | Po-Yu Huang, Chen-Ming Lee, I-Wen Wu, Mei-Yun Wang | 2023-10-17 |
| 11784222 | Epitaxial source/drain structure and method | I-Wen Wu, Chen-Ming Lee, Mei-Yun Wang, Chun-An Lin, Wei-Yuan Lu +2 more | 2023-10-10 |
| 11777004 | Fin field effect transistor (FinFET) device structure and method for forming the same | Kai-Hsuan Lee, I-Wen Wu, Chen-Ming Lee, Jian-Hao Chen, Feng-Cheng Yang +2 more | 2023-10-03 |
| 11757022 | Parasitic capacitance reduction | Jia-Heng Wang, Chun-Han Chen, I-Wen Wu, Chen-Ming Lee, Mei-Yun Wang | 2023-09-12 |
| 11742400 | Fin field effect transistor (FinFET) device structure with deep contact structure | Ting Fang, Da-Wen Lin, Chen-Ming Lee, Mei-Yun Wang | 2023-08-29 |
| 11735474 | Fin field effect transistor (FinFET) device structure with protection layer and method for forming the same | Chien-Yuan Chen, Chen-Ming Lee, Mei-Yun Wang | 2023-08-22 |
| 11728397 | Integrated circuits having protruding interconnect conductors | Chen-Hung Tsai, Chen-Ming Lee, Mei-Yun Wang | 2023-08-15 |
| 11728394 | Method of forming backside power rails | Po-Yu Huang, Chen-Ming Lee, I-Wen Wu, Mei-Yun Wang | 2023-08-15 |
| 11721626 | Semiconductor device with backside spacer and methods of forming the same | Po-Yu Huang, Chia-Hsien Yao, Mei-Yun Wang | 2023-08-08 |
| 11694931 | Metal gate structure cutting process | I-Wen Wu, Chen-Ming Lee, Mei-Yun Wang, Chang-Yun Chang, Ching-Feng Fu +1 more | 2023-07-04 |
| 11646346 | Contact structure with air spacer for semiconductor device and method for forming the same | Chung-Hao Cai, Chun Po Chang, Chien-Yuan Chen, Yen-Jun Huang, Ting Fang +2 more | 2023-05-09 |
| 11640936 | Interconnect structures and methods of fabrication thereof | Chao-Hsun Wang, Wang-Jung Hsueh, Mei-Yun Wang, Sheng-Hsiung Wang, Shih-Hsien Huang | 2023-05-02 |
| 11615987 | Backside via with a low-k spacer | Po-Yu Huang, I-Wen Wu, Chen-Ming Lee, Mei-Yun Wang | 2023-03-28 |
| 11615991 | Semiconductor device and method | Chien-Yuan Chen, Jui-Ping Lin, Chen-Ming Lee, Mei-Yun Wang | 2023-03-28 |
| 11581193 | Semiconductor device and a method for fabricating the same | Chen-Ming Lee, Mei-Yun Wang | 2023-02-14 |
| 11569364 | Silicide backside contact | Chen-Hung Tsai, Chen-Ming Lee, Mei-Yun Wang | 2023-01-31 |