Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854870 | Etch method for interconnect structure | Chun-Cheng Chou, Yu-Fang Huang, Ying-Liang Chuang, Chun-Neng Lin, Ming-Hsi Yeh +1 more | 2023-12-26 |
| 11791204 | Semiconductor device with connecting structure having a doped layer and method for forming the same | Chun-Hsien Huang, Su-Hao Liu, Liang-Yin Chen, Huicheng Chang, Yee-Chia Yeo | 2023-10-17 |
| 11742386 | Doping for semiconductor device with conductive feature | Su-Hao Liu, Huicheng Chang, Chia-Cheng Chen, Liang-Yin Chen, Chun-Hung Wu +4 more | 2023-08-29 |
| 11710659 | Metal loss prevention using implantation | Li-Chieh Wu, Tang-Kuei Chang, Kuo-Hsiu Wei, Kei-Wei Chen, Ying-Lang Wang +5 more | 2023-07-25 |
| 11682729 | Methods of forming air spacers in semiconductor devices | Chao-Hsun Wang, Chen-Ming Lee, Kuo-Yi Chao, Mei-Yun Wang, Pei-Yu Chou | 2023-06-20 |
| 11652053 | Semiconductor device and method for forming the same | Chun-Hsien Huang, Su-Hao Liu, Liang-Yin Chen, Huicheng Chang, Yee-Chia Yeo | 2023-05-16 |
| 11615982 | Reducing spacing between conductive features through implantation | Su-Hao Liu, Liang-Yin Chen, Huicheng Chang, Yee-Chia Yeo, Meng-Han Chou | 2023-03-28 |
| 11594636 | Source/drain structure | Su-Hao Liu, Wen-Yen Chen, Ying-Lang Wang, Liang-Yin Chen, Li-Ting Wang +1 more | 2023-02-28 |