Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817384 | Interconnect structure and manufacturing method for the same | Shuen-Shin Liang, Ken-Yu Chang, Hung-Yi Huang, Chien-Kuo Chang, Chi-Hung Chuang +7 more | 2023-11-14 |
| 11791204 | Semiconductor device with connecting structure having a doped layer and method for forming the same | Kuo-Ju Chen, Su-Hao Liu, Liang-Yin Chen, Huicheng Chang, Yee-Chia Yeo | 2023-10-17 |
| 11791208 | Method of forming contact metal | Hong-Mao Lee, Hsien-Lung Yang, Yu-Kai Chen, Wei-Jung Lin | 2023-10-17 |
| 11652053 | Semiconductor device and method for forming the same | Kuo-Ju Chen, Su-Hao Liu, Liang-Yin Chen, Huicheng Chang, Yee-Chia Yeo | 2023-05-16 |
| 11594609 | Liner-free conductive structures | Shuen-Shin Liang, Chun-I Tsai, Chih-Wei Chang, Hung-Yi Huang, Keng-Chu Lin +4 more | 2023-02-28 |