WL

Wei-Jung Lin

TSMC: 3 patents #1,075 of 4,064Top 30%
Overall (2023): #56,574 of 537,848Top 15%
3
Patents 2023

Issued Patents 2023

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
11798843 Conductive feature formation and structure Yu-Shih Wang, Chun-I Tsai, Shian Wei Mao, Ken-Yu Chang, Ming-Hsing Tsai 2023-10-24
11791208 Method of forming contact metal Chun-Hsien Huang, Hong-Mao Lee, Hsien-Lung Yang, Yu-Kai Chen 2023-10-17
11676859 Contact conductive feature formation and structure Ken-Yu Chang, Chun-I Tsai, Ming-Hsing Tsai 2023-06-13