Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817384 | Interconnect structure and manufacturing method for the same | Shuen-Shin Liang, Ken-Yu Chang, Hung-Yi Huang, Chien-Kuo Chang, Chi-Hung Chuang +7 more | 2023-11-14 |
| 11798843 | Conductive feature formation and structure | Yu-Shih Wang, Shian Wei Mao, Ken-Yu Chang, Ming-Hsing Tsai, Wei-Jung Lin | 2023-10-24 |
| 11676859 | Contact conductive feature formation and structure | Ken-Yu Chang, Ming-Hsing Tsai, Wei-Jung Lin | 2023-06-13 |
| 11670499 | Method of forming conductive feature including cleaning step | Cheng-Wei Chang, Min-Hsiu Hung, Ken-Yu Chang, Yi-Ying Liu | 2023-06-06 |
| 11594609 | Liner-free conductive structures | Shuen-Shin Liang, Chih-Wei Chang, Chun-Hsien Huang, Hung-Yi Huang, Keng-Chu Lin +4 more | 2023-02-28 |