Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742240 | Source/drain contact formation methods and devices | Yu-Ming Huang, Ethan Tseng, Ken-Yu Chang, Yi-Ying Liu | 2023-08-29 |
| 11670499 | Method of forming conductive feature including cleaning step | Min-Hsiu Hung, Chun-I Tsai, Ken-Yu Chang, Yi-Ying Liu | 2023-06-06 |
| 11652149 | Common rail contact | Hong-Ming Wu, Chen-Yuan Kao, Li-Hsiang Chao, Yi-Ying Liu | 2023-05-16 |
| 11581259 | Hybrid conductive structures | Chien-Shun Liao, Sung-Li Wang, Shuen-Shin Liang, Shu-Lan Chang, Yi-Ying Liu +2 more | 2023-02-14 |
| 11563083 | Dual side contact structures in semiconductor devices | Shuen-Shin Liang, Sung-Li Wang, Hsu-Kai Chang, Chia-Hung Chu, Chien-Shun Liao +1 more | 2023-01-24 |