Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837544 | Liner-free conductive structures with anchor points | Hsu-Kai Chang, Keng-Chu Lin, Sung-Li Wang, Shuen-Shin Liang | 2023-12-05 |
| 11817384 | Interconnect structure and manufacturing method for the same | Shuen-Shin Liang, Ken-Yu Chang, Hung-Yi Huang, Chien-Kuo Chang, Chi-Hung Chuang +7 more | 2023-11-14 |
| 11810960 | Contact structures in semiconductor devices | Sung-Li Wang, Hsu-Kai Chang, Jhih-Rong Huang, Yen-Tien Tung, Tzer-Min Shen +1 more | 2023-11-07 |
| 11626494 | Epitaxial backside contact | Sung-Li Wang, Shuen-Shin Liang, Hsu-Kai Chang, Ding-Kang Shih, Tsungyu Hung +2 more | 2023-04-11 |
| 11594609 | Liner-free conductive structures | Shuen-Shin Liang, Chun-I Tsai, Chih-Wei Chang, Chun-Hsien Huang, Hung-Yi Huang +4 more | 2023-02-28 |
| 11592748 | Method and apparatus for multi-spray RRC process with dynamic control | Ming-Hsuan Chuang, Po-Sheng Lu, Shou-Wen Kuo, Cheng-Yi Huang | 2023-02-28 |
| 11581259 | Hybrid conductive structures | Cheng-Wei Chang, Chien-Shun Liao, Sung-Li Wang, Shuen-Shin Liang, Shu-Lan Chang +2 more | 2023-02-14 |
| 11563083 | Dual side contact structures in semiconductor devices | Cheng-Wei Chang, Shuen-Shin Liang, Sung-Li Wang, Hsu-Kai Chang, Chien-Shun Liao +1 more | 2023-01-24 |