Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837544 | Liner-free conductive structures with anchor points | Keng-Chu Lin, Sung-Li Wang, Shuen-Shin Liang, Chia-Hung Chu | 2023-12-05 |
| 11817384 | Interconnect structure and manufacturing method for the same | Shuen-Shin Liang, Ken-Yu Chang, Hung-Yi Huang, Chien-Kuo Chang, Chi-Hung Chuang +7 more | 2023-11-14 |
| 11810960 | Contact structures in semiconductor devices | Sung-Li Wang, Jhih-Rong Huang, Yen-Tien Tung, Chia-Hung Chu, Tzer-Min Shen +1 more | 2023-11-07 |
| 11767336 | Organometallic cluster photoresists for EUV lithography | Chi-Ming Yang, Jui-Hsiung LIU, Jui-Hung Fu, Hsin-Yi Wu | 2023-09-26 |
| 11626494 | Epitaxial backside contact | Chia-Hung Chu, Sung-Li Wang, Shuen-Shin Liang, Ding-Kang Shih, Tsungyu Hung +2 more | 2023-04-11 |
| 11594609 | Liner-free conductive structures | Shuen-Shin Liang, Chun-I Tsai, Chih-Wei Chang, Chun-Hsien Huang, Hung-Yi Huang +4 more | 2023-02-28 |
| 11581259 | Hybrid conductive structures | Cheng-Wei Chang, Chien-Shun Liao, Sung-Li Wang, Shuen-Shin Liang, Shu-Lan Chang +2 more | 2023-02-14 |
| 11579531 | Organometallic cluster photoresists for EUV lithography | Chi-Ming Yang, Jui-Hsiung LIU, Jui-Hung Fu, Hsin-Yi Wu | 2023-02-14 |
| 11563083 | Dual side contact structures in semiconductor devices | Cheng-Wei Chang, Shuen-Shin Liang, Sung-Li Wang, Chia-Hung Chu, Chien-Shun Liao +1 more | 2023-01-24 |