Issued Patents 2023
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854898 | Wrap-around contact on FinFET | Neng-Kuo Chen, Ding-Kang Shih, Meng-Chun Chang, Yi-An Lin, Gin-Chen Huang +5 more | 2023-12-26 |
| 11855215 | Semiconductor device structure with high contact area | Shuen-Shin Liang, Pang-Yen Tsai, Keng-Chu Lin, Pinyen Lin | 2023-12-26 |
| 11855177 | Field effect transistors with dual silicide contact structures | Peng-Wei Chu, Ding-Kang Shih, Yasutoshi Okuno | 2023-12-26 |
| 11837544 | Liner-free conductive structures with anchor points | Hsu-Kai Chang, Keng-Chu Lin, Shuen-Shin Liang, Chia-Hung Chu | 2023-12-05 |
| 11823896 | Conductive structure formed by cyclic chemical vapor deposition | Mrunal A. Khaderbad, Keng-Chu Lin, Shuen-Shin Liang, Yasutoshi Okuno, Yu-Yun Peng | 2023-11-21 |
| 11817384 | Interconnect structure and manufacturing method for the same | Shuen-Shin Liang, Ken-Yu Chang, Hung-Yi Huang, Chien-Kuo Chang, Chi-Hung Chuang +7 more | 2023-11-14 |
| 11810960 | Contact structures in semiconductor devices | Hsu-Kai Chang, Jhih-Rong Huang, Yen-Tien Tung, Chia-Hung Chu, Tzer-Min Shen +1 more | 2023-11-07 |
| 11756864 | Contact plugs for semiconductor device | Mrunal A. Khaderbad, Yasutoshi Okuno, Pang-Yen Tsai, Shen-Nan Lee, Teng-Chun Tsai | 2023-09-12 |
| 11715763 | Method of forming metal contact for semiconductor device | Mrunal A. Khaderbad, Yasutoshi Okuno | 2023-08-01 |
| 11626494 | Epitaxial backside contact | Chia-Hung Chu, Shuen-Shin Liang, Hsu-Kai Chang, Ding-Kang Shih, Tsungyu Hung +2 more | 2023-04-11 |
| 11610888 | Semiconductor device having cap layer | Pang-Yen Tsai, Yasutoshi Okuno | 2023-03-21 |
| 11594609 | Liner-free conductive structures | Shuen-Shin Liang, Chun-I Tsai, Chih-Wei Chang, Chun-Hsien Huang, Hung-Yi Huang +4 more | 2023-02-28 |
| 11581259 | Hybrid conductive structures | Cheng-Wei Chang, Chien-Shun Liao, Shuen-Shin Liang, Shu-Lan Chang, Yi-Ying Liu +2 more | 2023-02-14 |
| 11563083 | Dual side contact structures in semiconductor devices | Cheng-Wei Chang, Shuen-Shin Liang, Hsu-Kai Chang, Chia-Hung Chu, Chien-Shun Liao +1 more | 2023-01-24 |
| 11557484 | Contact structures with deposited silicide layers | Yasutoshi Okuno, Shih-Chuan Chiu | 2023-01-17 |
| 11545429 | Interconnect structures having lines and vias comprising different conductive materials | Yasutoshi Okuno | 2023-01-03 |