Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817384 | Interconnect structure and manufacturing method for the same | Shuen-Shin Liang, Ken-Yu Chang, Hung-Yi Huang, Chi-Hung Chuang, Kai-Yi Chu +7 more | 2023-11-14 |
| 11699673 | Semiconductor package having varying conductive pad sizes | Chih-Hao Lin, Tzu-Kai Lan, Chung-Chih Chen, Jr-Lin Hsu | 2023-07-11 |