JH

Jr-Lin Hsu

TSMC: 1 patents #2,163 of 4,064Top 55%
Overall (2023): #381,308 of 537,848Top 75%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11699673 Semiconductor package having varying conductive pad sizes Chih-Hao Lin, Chien-Kuo Chang, Tzu-Kai Lan, Chung-Chih Chen 2023-07-11