Issued Patents 2023
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855215 | Semiconductor device structure with high contact area | Pang-Yen Tsai, Keng-Chu Lin, Sung-Li Wang, Pinyen Lin | 2023-12-26 |
| 11848238 | Methods for manufacturing semiconductor devices with tunable low-k inner air spacers | Chen-Han Wang, Keng-Chu Lin, Tetsuji Ueno, Ting-Ting Chen | 2023-12-19 |
| 11837544 | Liner-free conductive structures with anchor points | Hsu-Kai Chang, Keng-Chu Lin, Sung-Li Wang, Chia-Hung Chu | 2023-12-05 |
| 11823896 | Conductive structure formed by cyclic chemical vapor deposition | Mrunal A. Khaderbad, Keng-Chu Lin, Sung-Li Wang, Yasutoshi Okuno, Yu-Yun Peng | 2023-11-21 |
| 11817384 | Interconnect structure and manufacturing method for the same | Ken-Yu Chang, Hung-Yi Huang, Chien-Kuo Chang, Chi-Hung Chuang, Kai-Yi Chu +7 more | 2023-11-14 |
| 11688766 | Seal material for air gaps in semiconductor devices | Chen-Han Wang, Keng-Chu Lin, Tetsuji Ueno, Ting-Ting Chen | 2023-06-27 |
| 11626494 | Epitaxial backside contact | Chia-Hung Chu, Sung-Li Wang, Hsu-Kai Chang, Ding-Kang Shih, Tsungyu Hung +2 more | 2023-04-11 |
| 11626482 | Air spacer formation with a spin-on dielectric material | Ting-Ting Chen, Chen-Han Wang, Keng-Chu Lin, Tsu-Hsiu Perng, Tsai-Jung Ho +3 more | 2023-04-11 |
| 11594609 | Liner-free conductive structures | Chun-I Tsai, Chih-Wei Chang, Chun-Hsien Huang, Hung-Yi Huang, Keng-Chu Lin +4 more | 2023-02-28 |
| 11581259 | Hybrid conductive structures | Cheng-Wei Chang, Chien-Shun Liao, Sung-Li Wang, Shu-Lan Chang, Yi-Ying Liu +2 more | 2023-02-14 |
| 11563083 | Dual side contact structures in semiconductor devices | Cheng-Wei Chang, Sung-Li Wang, Hsu-Kai Chang, Chia-Hung Chu, Chien-Shun Liao +1 more | 2023-01-24 |