Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848238 | Methods for manufacturing semiconductor devices with tunable low-k inner air spacers | Keng-Chu Lin, Shuen-Shin Liang, Tetsuji Ueno, Ting-Ting Chen | 2023-12-19 |
| 11735666 | Gate all around structure with additional silicon layer and method for forming the same | Pei-Hsun Wang, Chun-Hsiung Lin, Chih-Hao Wang | 2023-08-22 |
| 11688766 | Seal material for air gaps in semiconductor devices | Shuen-Shin Liang, Keng-Chu Lin, Tetsuji Ueno, Ting-Ting Chen | 2023-06-27 |
| 11637062 | Interconnect structure and method for manufacturing the interconnect structure | KHADERBAD MRUNAL ABHIJITH, Yu-Yun Peng, Fu-Ting Yen, Tsu-Hsiu Perng, Keng-Chu Lin | 2023-04-25 |
| 11626482 | Air spacer formation with a spin-on dielectric material | Ting-Ting Chen, Keng-Chu Lin, Shuen-Shin Liang, Tsu-Hsiu Perng, Tsai-Jung Ho +3 more | 2023-04-11 |