Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11637062 | Interconnect structure and method for manufacturing the interconnect structure | Yu-Yun Peng, Fu-Ting Yen, Chen-Han Wang, Tsu-Hsiu Perng, Keng-Chu Lin | 2023-04-25 |
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Overall (2023): #365,283 of 537,848Top 70%
1
Patents 2023