Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817384 | Interconnect structure and manufacturing method for the same | Shuen-Shin Liang, Hung-Yi Huang, Chien-Kuo Chang, Chi-Hung Chuang, Kai-Yi Chu +7 more | 2023-11-14 |
| 11798843 | Conductive feature formation and structure | Yu-Shih Wang, Chun-I Tsai, Shian Wei Mao, Ming-Hsing Tsai, Wei-Jung Lin | 2023-10-24 |
| 11742240 | Source/drain contact formation methods and devices | Cheng-Wei Chang, Yu-Ming Huang, Ethan Tseng, Yi-Ying Liu | 2023-08-29 |
| 11676859 | Contact conductive feature formation and structure | Chun-I Tsai, Ming-Hsing Tsai, Wei-Jung Lin | 2023-06-13 |
| 11670499 | Method of forming conductive feature including cleaning step | Cheng-Wei Chang, Min-Hsiu Hung, Chun-I Tsai, Yi-Ying Liu | 2023-06-06 |
| 11594609 | Liner-free conductive structures | Shuen-Shin Liang, Chun-I Tsai, Chih-Wei Chang, Chun-Hsien Huang, Hung-Yi Huang +4 more | 2023-02-28 |