Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798843 | Conductive feature formation and structure | Yu-Shih Wang, Chun-I Tsai, Shian Wei Mao, Ken-Yu Chang, Wei-Jung Lin | 2023-10-24 |
| 11676859 | Contact conductive feature formation and structure | Ken-Yu Chang, Chun-I Tsai, Wei-Jung Lin | 2023-06-13 |
| 11552018 | Chemical direct pattern plating method | Wen-Jiun Liu, Chen-Yuan Kao, Hung-Wen Su, Syun-Ming Jang | 2023-01-10 |