Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798843 | Conductive feature formation and structure | Yu-Shih Wang, Chun-I Tsai, Ken-Yu Chang, Ming-Hsing Tsai, Wei-Jung Lin | 2023-10-24 |
| 11557512 | Wet cleaning with tunable metal recess for via plugs | Yu-Shih Wang, Ming-Hsi Yeh, Kuo-Bin Huang | 2023-01-17 |