Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855144 | Source/drain metal contact and formation thereof | Chia-Hao Chang, Jia-Chuan You, Tien-Lu Lin, Yu-Ming Lin, Chih-Hao Wang | 2023-12-26 |
| 11804486 | Backside power rail and methods of forming the same | Huan-Chieh Su, Li-Zhen Yu, Chun-Yuan Chen, Cheng-Chi Chuang, Yu-Ming Lin +1 more | 2023-10-31 |
| 11777003 | Semiconductor structure with wraparound backside amorphous layer | Huan-Chieh Su, Pei-Yu Wang, Cheng-Chi Chuang, Chun-Yuan Chen, Li-Zhen Yu +3 more | 2023-10-03 |
| 11557484 | Contact structures with deposited silicide layers | Sung-Li Wang, Yasutoshi Okuno | 2023-01-17 |