Issued Patents 2023
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854791 | Metal source/drain features | — | 2023-12-26 |
| 11843050 | Semiconductor arrangement and method of manufacture | Sai-Hooi Yeong | 2023-12-12 |
| 11784233 | Integrated circuit structure with backside via rail | Huan-Chieh Su, Li-Zhen Yu, Chun-Yuan Chen, Cheng-Chi Chuang, Shang-Wen Chang +3 more | 2023-10-10 |
| 11777003 | Semiconductor structure with wraparound backside amorphous layer | Shih-Chuan Chiu, Huan-Chieh Su, Cheng-Chi Chuang, Chun-Yuan Chen, Li-Zhen Yu +3 more | 2023-10-03 |
| 11764262 | Multi-gate device with air gap spacer and fabrication methods thereof | Wei Ju Lee | 2023-09-19 |
| 11757042 | Semiconductor device and method | Yi-Bo Liao, Yu-Xuan Huang, Cheng-Ting Chung, Ching-Wei Tsai, Hou-Yu Chen | 2023-09-12 |
| 11742387 | Hybrid channel semiconductor device and method | Pei-Hsun Wang | 2023-08-29 |
| 11713097 | Harmonic drive system for pedal electric cycle | Wei Ke | 2023-08-01 |
| 11676819 | Method for metal gate cut and structure thereof | Zhi-Chang Lin, Ching-Wei Tsai, Kuan-Lun Cheng | 2023-06-13 |
| 11664451 | Method and device for boosting performance of FinFETs via strained spacer | Kai-Chieh Yang, Li-Yang Chuang, Wei Ju Lee, Ching-Wei Tsai, Kuan-Lun Cheng | 2023-05-30 |
| 11652043 | Integrated circuit structure with backside via | Yu-Xuan Huang | 2023-05-16 |
| 11616143 | Semiconductor devices with backside power rail and methods of fabrication thereof | Chun-Yuan Chen, Huan-Chieh Su, Chih-Hao Wang | 2023-03-28 |
| 11594612 | Metal oxide interlayer structure for nFET and pFET | Min Cao, Sai-Hooi Yeong, Ching-Wei Tsai, Kuan-Lun Cheng, Chih-Hao Wang | 2023-02-28 |
| 11581410 | Semiconductor device and method | Sai-Hooi Yeong, Chi On Chui | 2023-02-14 |
| 11581437 | Semiconductor device structure and methods of forming the same | Kuan-Ting Pan, Kuo-Cheng Chiang, Cheng-Ting Chung, Chih-Hao Wang | 2023-02-14 |