Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855224 | Leakage prevention structure and method | Ching-Wei Tsai, Yi-Bo Liao, Sai-Hooi Yeong, Hou-Yu Chen, Kuan-Lun Cheng | 2023-12-26 |
| 11837535 | Semiconductor devices including decoupling capacitors | Hou-Yu Chen, Ching-Wei Tsai, Kuan-Lun Cheng, Chung-Hui Chen | 2023-12-05 |
| 11810917 | Self-aligned etch in semiconductor devices | Yi-Hsun Chiu, Ching-Wei Tsai, Cheng-Chi Chuang, Shang-Wen Chang | 2023-11-07 |
| 11756959 | Structure and method of integrated circuit having decouple capacitance | Ching-Wei Tsai, Kuan-Lun Cheng, Wei Ju Lee, Chun-Fu Cheng, Chung-Wei Wu | 2023-09-12 |
| 11757042 | Semiconductor device and method | Yi-Bo Liao, Pei-Yu Wang, Cheng-Ting Chung, Ching-Wei Tsai, Hou-Yu Chen | 2023-09-12 |
| 11735587 | Backside PN junction diode | Ching-Wei Tsai, Jam-Wem Lee, Kuo-Ji Chen, Kuan-Lun Cheng | 2023-08-22 |
| 11705488 | Nano-sheet-based devices with asymmetric source and drain configurations | Cheng-Ting Chung, Yi-Bo Liao, Ching-Wei Tsai, Kuan-Lun Cheng | 2023-07-18 |
| 11658119 | Backside signal interconnection | Ching-Wei Tsai, Yi-Hsun Chiu, Yi-Bo Liao, Kuan-Lun Cheng, Wei-Cheng Lin +6 more | 2023-05-23 |
| 11652043 | Integrated circuit structure with backside via | Pei-Yu Wang | 2023-05-16 |
| 11610805 | Replacement material for backside gate cut feature | Wang-Chun Huang, Hou-Yu Chen, Kuan-Lun Cheng, Chih-Hao Wang | 2023-03-21 |