Issued Patents 2023
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11851325 | Methods for wafer bonding | Chien-Wei Chang, Ya-Jen Sheuh, Ren-Dou Lee, Yi-Chih Chang, Yuan-Hsin Chi | 2023-12-26 |
| 11856762 | Memory devices and methods of manufacturing thereof | Meng-Sheng Chang, Chia-En Huang, Yih Wang | 2023-12-26 |
| 11848327 | Integrated circuit device including a power supply line and method of forming the same | Yi-Hsiung Lin, Shang-Wen Chang | 2023-12-19 |
| 11810917 | Self-aligned etch in semiconductor devices | Ching-Wei Tsai, Yu-Xuan Huang, Cheng-Chi Chuang, Shang-Wen Chang | 2023-11-07 |
| 11791215 | Fin field effect transistor device structure | Shang-Wen Chang, Yi-Hsiung Lin | 2023-10-17 |
| 11784233 | Integrated circuit structure with backside via rail | Huan-Chieh Su, Li-Zhen Yu, Chun-Yuan Chen, Cheng-Chi Chuang, Shang-Wen Chang +3 more | 2023-10-10 |
| 11765878 | Semiconductor device including a layer between a source/drain region and a substrate | Kam-Tou Sio | 2023-09-19 |
| 11695150 | Semiconductor structures having a micro-battery and methods for making the same | Chyi-Tsong Ni, I-Shi Wang, Ching-Hou Su | 2023-07-04 |
| 11694927 | Formation method of semiconductor device with contact structures | Yi-Hsiung Lin, Shang-Wen Chang | 2023-07-04 |
| 11682590 | Methods of forming contact features in field-effect transistors | Yi-Hsiung Lin, Shang-Wen Chang | 2023-06-20 |
| 11664278 | Semiconductor device with L-shape conductive feature and methods of forming the same | Cheng-Chi Chuang, Li-Zhen Yu, Yu-Ming Lin, Chih-Hao Wang | 2023-05-30 |
| 11658119 | Backside signal interconnection | Yu-Xuan Huang, Ching-Wei Tsai, Yi-Bo Liao, Kuan-Lun Cheng, Wei-Cheng Lin +6 more | 2023-05-23 |
| 11652102 | Integrated circuit structure and method of forming the same | Kam-Tou Sio, Chih-Liang Chen, Charles Chew-Yuen Young, Hui-Zhong Zhuang, Jiann-Tyng Tzeng | 2023-05-16 |
| 11563014 | Memory devices and methods of manufacturing thereof | Meng-Sheng Chang, Chia-En Huang, Yih Wang | 2023-01-24 |
| 11563015 | Memory devices and methods of manufacturing thereof | Meng-Sheng Chang, Chia-En Huang, Yih Wang | 2023-01-24 |