Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11772963 | Bonding process for forming semiconductor device structure | Chih-Hang Chang, Jen-Hao Liu | 2023-10-03 |
| 11721662 | Wafer bonding method and wafer bonding apparatus | Yun-Tai Shih, Ching-Hou Su, Chyi-Tsong Ni, Jeng-Hao Lin, Kuan-Ming Pan +2 more | 2023-08-08 |
| 11695150 | Semiconductor structures having a micro-battery and methods for making the same | Chyi-Tsong Ni, Yi-Hsun Chiu, Ching-Hou Su | 2023-07-04 |
| 11655146 | Extended acid etch for oxide removal | Hong-Ta Kuo, Tzu-Ping Yang, Hsing-Yu Wang, Shu-Han CHAO, Hsi-Cheng Hsu +3 more | 2023-05-23 |