Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11772963 | Bonding process for forming semiconductor device structure | Chih-Hang Chang, I-Shi Wang | 2023-10-03 |
JL
Jen-Hao Liu
Overall (2023): #401,372 of 537,848Top 75%
1
Patents 2023