Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11772963 | Bonding process for forming semiconductor device structure | I-Shi Wang, Jen-Hao Liu | 2023-10-03 |
| 11626177 | Anti-fuse sensing device and operation method thereof | — | 2023-04-11 |