Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11815471 | Systems and methods for wafer bond monitoring | Chih-Yu Wang | 2023-11-14 |
| 11789360 | Photomask assembly and method of forming the same | Kuo-Hao Lee, Jui-Chun Weng, Han-Zong Pan, Hsin-Yu Chen, You-Cheng Jhang | 2023-10-17 |
| 11782284 | Multifunctional collimator for contact image sensors | Hsin-Yu Chen, Yen-Chiang Liu, Jiun-Jie Chiou, Jia-Syuan Li, You-Cheng Jhang +9 more | 2023-10-10 |
| 11742320 | Wafer bonding alignment | Jui-Chun Weng, Ching-Hsiang Hu, Ji-Hong Chiang, Kuo-Hao Lee, Chia-Yu Lin +4 more | 2023-08-29 |
| 11726342 | Multifunctional collimator for contact image sensors | Hsin-Yu Chen, Chun-Peng Li, Chia-Chun Hung, Ching-Hsiang Hu, Wei-Ding Wu +10 more | 2023-08-15 |
| 11655146 | Extended acid etch for oxide removal | Hong-Ta Kuo, I-Shi Wang, Tzu-Ping Yang, Hsing-Yu Wang, Shu-Han CHAO +3 more | 2023-05-23 |
| 11655138 | Roughness selectivity for MEMS movement stiction reduction | Kuo-Hao Lee, Jui-Chun Weng, Ching-Hsiang Hu, Ji-Hong Chiang, Lavanya Sanagavarapu +4 more | 2023-05-23 |
| 11543363 | Systems and methods for wafer bond monitoring | Chih-Yu Wang | 2023-01-03 |