Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11828754 | Modified electrode, manufacturing method thereof and use thereof | Shu-Yu Lin, Yi-Hsuan Lai, Shih-Ching Huang, Tzu-Hsuan Wang, Ting-rong Ko | 2023-11-28 |
| 11742320 | Wafer bonding alignment | Hsi-Cheng Hsu, Jui-Chun Weng, Ching-Hsiang Hu, Ji-Hong Chiang, Kuo-Hao Lee +4 more | 2023-08-29 |
| 11732981 | Heat dissipation device | Chang-Yu Hsieh, Shan-Yin Cheng, Hsiang-Fen CHOU | 2023-08-22 |
| 11725885 | Heat exchanger fin and manufacturing method of the same | Shan-Yin Cheng | 2023-08-15 |
| 11713273 | Glass material with low dielectric constant and low fiberizing temperature | — | 2023-08-01 |
| 11692777 | Heat exchanger fin and manufacturing method of the same | Shan-Yin Cheng | 2023-07-04 |
| 11655138 | Roughness selectivity for MEMS movement stiction reduction | Hsi-Cheng Hsu, Kuo-Hao Lee, Jui-Chun Weng, Ching-Hsiang Hu, Ji-Hong Chiang +4 more | 2023-05-23 |
| 11598587 | Method of manufacturing a heat exchanger | Shan-Yin Cheng | 2023-03-07 |
| 11598588 | Method of manufacturing a heat exchanger | Shan-Yin Cheng | 2023-03-07 |