Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721662 | Wafer bonding method and wafer bonding apparatus | Ching-Hou Su, Chyi-Tsong Ni, I-Shi Wang, Jeng-Hao Lin, Kuan-Ming Pan +2 more | 2023-08-08 |
YS
Yun-Tai Shih
Overall (2023): #187,299 of 537,848Top 35%
1
Patents 2023