Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854776 | Permeance magnetic assembly | Tsung-Jen Yang, Yi-Zhen Chen, Chih-Pin WANG, Chao-Li Shih, Cheng-Yi Huang | 2023-12-26 |
| 11721662 | Wafer bonding method and wafer bonding apparatus | Yun-Tai Shih, Chyi-Tsong Ni, I-Shi Wang, Jeng-Hao Lin, Kuan-Ming Pan +2 more | 2023-08-08 |
| 11695150 | Semiconductor structures having a micro-battery and methods for making the same | Chyi-Tsong Ni, I-Shi Wang, Yi-Hsun Chiu | 2023-07-04 |
| 11688633 | Passivation layer for integrated circuit structure and forming the same | Chun-Chiang Chen, Chun-Ting Wu, Chih-Pin WANG | 2023-06-27 |