Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854776 | Permeance magnetic assembly | Tsung-Jen Yang, Yi-Zhen Chen, Chao-Li Shih, Ching-Hou Su, Cheng-Yi Huang | 2023-12-26 |
| 11688633 | Passivation layer for integrated circuit structure and forming the same | Chun-Chiang Chen, Chun-Ting Wu, Ching-Hou Su | 2023-06-27 |