Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11850702 | Chemical mechanical planarization membrane | Cheng-Ping Chen, Ren-Dou Lee, Sheng-Tai Peng, Tsung-Lung Lai, Tzi-Yi Shieh | 2023-12-26 |
| 11851325 | Methods for wafer bonding | Ya-Jen Sheuh, Ren-Dou Lee, Yi-Chih Chang, Yi-Hsun Chiu, Yuan-Hsin Chi | 2023-12-26 |