Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11850702 | Chemical mechanical planarization membrane | Cheng-Ping Chen, Sheng-Tai Peng, Tsung-Lung Lai, Tzi-Yi Shieh, Chien-Wei Chang | 2023-12-26 |
| 11851325 | Methods for wafer bonding | Chien-Wei Chang, Ya-Jen Sheuh, Yi-Chih Chang, Yi-Hsun Chiu, Yuan-Hsin Chi | 2023-12-26 |
| 11688620 | Shiftless wafer blades | Chien-Chih Chen, Yao-Min Yu, Ching-Ling Lee | 2023-06-27 |