Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11851325 | Methods for wafer bonding | Chien-Wei Chang, Ya-Jen Sheuh, Ren-Dou Lee, Yi-Chih Chang, Yi-Hsun Chiu | 2023-12-26 |
| 11655146 | Extended acid etch for oxide removal | Hong-Ta Kuo, I-Shi Wang, Tzu-Ping Yang, Hsing-Yu Wang, Shu-Han CHAO +3 more | 2023-05-23 |
| 11600506 | Wafer pod transfer assembly | Chih-Wei Chou, Sheng Lin, Yin-Tun Chou, Hung-Chih Wang, Yu Liu | 2023-03-07 |