Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600506 | Wafer pod transfer assembly | Chih-Wei Chou, Sheng Lin, Yuan-Hsin Chi, Yin-Tun Chou, Hung-Chih Wang | 2023-03-07 |
YL
Yu Liu
Overall (2023): #188,614 of 537,848Top 40%
1
Patents 2023