Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600506 | Wafer pod transfer assembly | Sheng Lin, Yuan-Hsin Chi, Yin-Tun Chou, Hung-Chih Wang, Yu Liu | 2023-03-07 |
CC
Chih-Wei Chou
Overall (2023): #492,793 of 537,848Top 95%
1
Patents 2023