Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11851325 | Methods for wafer bonding | Chien-Wei Chang, Ya-Jen Sheuh, Ren-Dou Lee, Yi-Hsun Chiu, Yuan-Hsin Chi | 2023-12-26 |
YC
Yi-Chih Chang
Overall (2023): #197,540 of 537,848Top 40%
1
Patents 2023