Issued Patents 2023
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854866 | Enlarging contact area and process window for a contact via | Li-Zhen Yu, Chih-Hao Wang, Yu-Ming Lin, Lin-Yu Huang | 2023-12-26 |
| 11848372 | Method and structure for reducing source/drain contact resistance at wafer backside | Huan-Chieh Su, Li-Zhen Yu, Chun-Yuan Chen, Kuan-Lun Cheng, Chih-Hao Wang | 2023-12-19 |
| 11842967 | Semiconductor devices with backside power distribution network and frontside through silicon via | Kam-Tou Sio, Chia-Tien Wu, Jiann-Tyng Tzeng, Shih-Wei Peng, Wei-Cheng Lin | 2023-12-12 |
| 11842962 | Interconnect structure with air-gaps | Tai-I Yang, Yung-Chih Wang, Tien-Lu Lin | 2023-12-12 |
| 11830769 | Semiconductor device with air gaps and method of fabrication thereof | Chia-Hao Chang, Lin-Yu Huang, Li-Zhen Yu, Kuan-Lun Cheng, Chih-Hao Wang | 2023-11-28 |
| 11817491 | Semiconductor device having an air gap along a gate spacer | Chia-Hao Chang, Lin-Yu Huang, Sheng-Tsung Wang, Yu-Ming Lin, Chih-Hao Wang | 2023-11-14 |
| 11810917 | Self-aligned etch in semiconductor devices | Yi-Hsun Chiu, Ching-Wei Tsai, Yu-Xuan Huang, Shang-Wen Chang | 2023-11-07 |
| 11804486 | Backside power rail and methods of forming the same | Huan-Chieh Su, Li-Zhen Yu, Chun-Yuan Chen, Shih-Chuan Chiu, Yu-Ming Lin +1 more | 2023-10-31 |
| 11798884 | Contact via formation | Lin-Yu Huang, Li-Zhen Yu, Chia-Hao Chang, Kuan-Lun Cheng, Chih-Hao Wang | 2023-10-24 |
| 11784228 | Process and structure for source/drain contacts | Meng-Huan Jao, Lin-Yu Huang, Sheng-Tsung Wang, Huan-Chieh Su, Chih-Hao Wang | 2023-10-10 |
| 11784233 | Integrated circuit structure with backside via rail | Huan-Chieh Su, Li-Zhen Yu, Chun-Yuan Chen, Shang-Wen Chang, Yi-Hsun Chiu +3 more | 2023-10-10 |
| 11777003 | Semiconductor structure with wraparound backside amorphous layer | Shih-Chuan Chiu, Huan-Chieh Su, Pei-Yu Wang, Chun-Yuan Chen, Li-Zhen Yu +3 more | 2023-10-03 |
| 11769696 | Method for fabricating a semiconductor device | Chun-Yuan Chen, Li-Zhen Yu, Huan-Chieh Su, Lo-Heng Chang, Chih-Hao Wang | 2023-09-26 |
| 11749728 | Semiconductor device and manufacturing method thereof | Li-Zhen Yu, Chia-Hao Chang, Yu-Ming Lin, Chih-Hao Wang | 2023-09-05 |
| 11742385 | Selective liner on backside via and method thereof | Lin-Yu Huang, Li-Zhen Yu, Chia-Hao Chang, Kuan-Lun Cheng, Chih-Hao Wang | 2023-08-29 |
| 11728211 | Semiconductor device structure and methods of forming the same | Lin-Yu Huang, Li-Zhen Yu, Chia-Hao Chang, Kuan-Lun Cheng, Chih-Hao Wang | 2023-08-15 |
| 11721623 | Backside connection structures for nanostructures and methods of forming the same | Li-Zhen Yu, Chia-Hao Chang, Lin-Yu Huang, Chih-Hao Wang | 2023-08-08 |
| 11715764 | Semiconductor device structure and methods of forming the same | Lin-Yu Huang, Li-Zhen Yu, Kuan-Lun Cheng, Chih-Hao Wang | 2023-08-01 |
| 11710664 | Semiconductor structure with backside via contact and a protection liner layer | Li-Zhen Yu, Chia-Hao Chang, Huan-Chieh Su, Lin-Yu Huang, Yu-Ming Lin +1 more | 2023-07-25 |
| 11710742 | Semiconductor devices with backside contacts and isolation | Chun-Yuan Chen, Huan-Chieh Su, Chih-Hao Wang | 2023-07-25 |
| 11688691 | Method of making standard cells having via rail and deep via structures | Wei-Cheng Lin, Chih-Liang Chen, Charles Chew-Yuen Young, Hui-Ting Yang, Wayne Lai | 2023-06-27 |
| 11682730 | Connector via structures for nanostructures and methods of forming the same | Li-Zhen Yu, Chia-Hao Chang, Lin-Yu Huang, Chih-Hao Wang | 2023-06-20 |
| 11682707 | Contact formation method and related structure | Lin-Yu Huang, Li-Zhen Yu, Chia-Hao Chang, Kuan-Lun Cheng, Chih-Hao Wang | 2023-06-20 |
| 11670691 | Method for forming source/drain contacts utilizing an inhibitor | Lin-Yu Huang, Li-Zhen Yu, Chia-Hao Chang, Yu-Ming Lin, Chih-Hao Wang | 2023-06-06 |
| 11670581 | Interconnect structure | Lin-Yu Huang, Li-Zhen Yu, Chia-Hao Chang, Kuan-Lun Cheng, Chih-Hao Wang | 2023-06-06 |