Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11852420 | Thermal dissipation module | Jau-Han Ke, Wen-Neng Liao, Cheng-Wen Hsieh | 2023-12-26 |
| 11842962 | Interconnect structure with air-gaps | Tai-I Yang, Cheng-Chi Chuang, Tien-Lu Lin | 2023-12-12 |
| 11764106 | Semiconductor device and method of manufacture | Tai-I Yang, Wei-Chen Chu, Chia-Tien Wu, Hsin-Ping Chen, Shau-Lin Shue | 2023-09-19 |
| 11609048 | Thermal dissipation module | Jau-Han Ke, Wen-Neng Liao, Cheng-Wen Hsieh | 2023-03-21 |