Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848190 | Barrier-less structures | Yung-Hsu Wu, Chia-Tien Wu, Min Cao, Ming-Han Lee, Shau-Lin Shue +1 more | 2023-12-19 |
| 11764106 | Semiconductor device and method of manufacture | Tai-I Yang, Wei-Chen Chu, Yung-Chih Wang, Chia-Tien Wu, Shau-Lin Shue | 2023-09-19 |
| 11682618 | Hybrid metal line structure | Pokuan Ho, Chia-Tien Wu, Wei-Chen Chu | 2023-06-20 |
| 11640924 | Structure and method for interconnection with self-alignment | Tai-I Yang, Yu-Chieh Liao, Chia-Tien Wu, Hai-Ching Chen, Shau-Lin Shue | 2023-05-02 |