Issued Patents 2023
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854987 | Semiconductor packages with interconnection features in a seal region and methods for forming the same | Shin-Yi Yang, Shau-Lin Shue | 2023-12-26 |
| 11854944 | Semiconductor packages and methods for forming the same | Shin-Yi Yang, Shau-Lin Shue | 2023-12-26 |
| 11848190 | Barrier-less structures | Hsin-Ping Chen, Yung-Hsu Wu, Chia-Tien Wu, Min Cao, Shau-Lin Shue +1 more | 2023-12-19 |
| 11830910 | Semiconductor structure having air gaps and method for manufacturing the same | Chieh-Han Wu, Hwei-Jay CHU, An-Dih Yu, Tzu-Hui Wei, Cheng-Hsiung Tsai +2 more | 2023-11-28 |
| 11810816 | Chemical mechanical polishing topography reset and control on interconnect metal lines | Shih-Kang Fu | 2023-11-07 |
| 11749643 | Semiconductor packages and methods for forming the same | Shin-Yi Yang, Shau-Lin Shue | 2023-09-05 |
| 11742239 | Methods of performing chemical-mechanical polishing process in semiconductor devices | Shih-Kang Fu, Shau-Lin Shue | 2023-08-29 |
| 11735513 | Integrated chip having a back-side power rail | Shin-Yi Yang, Shau-Lin Shue | 2023-08-22 |
| 11728264 | Hybrid interconnect structure for self aligned via | Shin-Yi Yang, Shau-Lin Shue | 2023-08-15 |
| 11721627 | Graphene layer for reduced contact resistance | Shin-Yi Yang, Shau-Lin Shue | 2023-08-08 |
| 11715689 | Method of forming metal interconnection | Shin-Yi Yang, Shau-Lin Shue, Tz-Jun Kuo | 2023-08-01 |
| 11710700 | Graphene-assisted low-resistance interconnect structures and methods of formation thereof | Shin-Yi Yang, Yu-Chen Chan, Hai-Ching Chen, Shau-Lin Shue | 2023-07-25 |
| 11682620 | Graded metallic liner for metal interconnect structures and methods for forming the same | Shu-Wei Li, Guanyu Luo, Shin-Yi Yang | 2023-06-20 |
| 11682616 | Semiconductor structure and method for forming the same | Meng-Pei Lu, Shin-Yi Yang, Shu-Wei Li, Chin-Lung Chung | 2023-06-20 |
| 11670595 | Semiconductor device structure and methods of forming the same | Yu-Chen Chan, Shu-Wei Li, Shin-Yi Yang, Shau-Lin Shue | 2023-06-06 |
| 11652055 | Interconnect structure with hybrid barrier layer | Shu-Wei Li, Shin-Yi Yang, Shau-Lin Shue | 2023-05-16 |
| 11640940 | Methods of forming interconnection structure including conductive graphene layers | Shu-Wei Li, Yu-Chen Chan, Shin-Yi Yang, Shau-Lin Shue | 2023-05-02 |
| 11605558 | Integrated circuit interconnect structure having discontinuous barrier layer and air gap | Chin-Lung Chung, Shin-Yi Yang | 2023-03-14 |
| 11605591 | Semiconductor device structure and methods of forming the same | Shu-Wei Li, Guanyu Luo, Shin-Yi Yang | 2023-03-14 |
| 11594483 | Semiconductor structure | Shin-Yi Yang, Shau-Lin Shue | 2023-02-28 |
| 11551967 | Via structure and methods for forming the same | Meng-Pei Lu, Shin-Yi Yang, Tz-Jun Kuo | 2023-01-10 |
| 11545389 | Titanium-containing diffusion barrier for CMP removal rate enhancement and contamination reduction | Shih-Kang Fu, Shau-Lin Shue | 2023-01-03 |